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revisions ltr description date (yr-mo-da) approved a add case outline 2 to device type 01. update document. editorial changes throughout. 89-09-13 m. a. frye b delete vendor cage 64155. change boilerplate to add one-part numbers. add delta test limit table. make changes to i io , i ib , and a vo tests as specified under table i. 96-12-31 r. monnin c add radiation hardened assurance requirements. - ro 99-02-16 r. monnin d replaced reference to mil-std-973 with reference to mil-prf-38535. drawing updated to reflect current requirements. - gt 04-08-06 r. monnin e add a new footnote under paragraph 1.5 and table i. - ro 05-08-10 r. monnin f add device type 04. make changes to 1.2.2, table i, figure 1, and table iib. - ro 08-06-06 r. heber g make correction to the smd number on sheets 2 through 12. under paragraph 1.5, delete neutron and dose rate latch up information. delete paragraphs 4.4.4.1.1 and 4.4.4.2. - ro 10-09-21 c. saffle the original first sheet of this drawing has been replaced. rev sheet rev sheet rev status rev g g g g g g g g g g g g of sheets sheet 1 2 3 4 5 6 7 8 9 10 11 12 pmic n/a prepared by joseph a. kerby dla land and maritime columbus, ohio 43218-3990 http://www.dscc.dla.mil standard microcircuit drawing this drawing is available for use by all departments and agencies of the department of defense checked by raymond monnin approved by michael a. frye microcircuit, linear, dual precision jfet-input operational amplifiers, monolithic silicon drawing approval date 88-10-07 amsc n/a revision level g size a cage code 67268 5962-88538 sheet 1 of 12 dscc form 2233 apr 97 5962-e408-10
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 2 dscc form 2234 apr 97 1. scope 1.1 scope . this drawing documents two product assurance class levels consisting of high reliability (device classes q and m) and space application (device class v). a choice of case outli nes and lead finishes are available and are reflected in the part or identifying number (pin). when availabl e, a choice of radiation hardness assuranc e (rha) levels is reflected in the pin. 1.2 pin . the pin is as shown in the following examples. for device classes m and q: 5962 - 88538 01 g a federal stock class designator rha designator (see 1.2.1) device type (see 1.2.2) case outline (see 1.2.4) lead finish (see 1.2.5) \ / \/ drawing number for device class v: 5962 r 88538 01 v g a federal stock class designator rha designator (see 1.2.1) device type (see 1.2.2) device class designator case outline (see 1.2.4) lead finish (see 1.2.5) \ / (see 1.2.3) \/ drawing number 1.2.1 rha designator . device classes q and v rha marked devices meet the mil-prf-38535 specified rha levels and are marked with the appropriate rha designator. device class m rha marked devices meet the mil-prf-38535, appendix a specified rha levels and are marked with the appropriate rha designator. a dash (-) indicates a non-rha device. 1.2.2 device type(s) . the device type(s) identify the circuit function as follows: device type generic number circuit function 01 op215a dual, precision jfet ? input operational amplifier 02 op215b dual, precision jfet ? input operational amplifier 03 op215b dual, precision jfet ? input operational amplifier with balance adjust 04 op215a dual, precision jfet ? input operational amplifier with balance adjust 1.2.3 device class designator . the device class designator is a single letter identifying the product assurance level as listed below. since the device class designator has been added after t he original issuance of this drawing, device classes m and q designators will not be included in the pin and will not be marked on the device. device class device requirements documentation m vendor self-certification to the r equirements for mil-std-883 compliant, non- jan class level b microcircuits in accordance with mil-prf-38535, appendix a q or v certification and qualif ication to mil-prf-38535
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 3 dscc form 2234 apr 97 1.2.4 case outline(s) . the case outline(s) are as designated in mil-std-1835 and as follows: outline letter descriptive designator terminals package style g macy1-x8 8 can p gdip1-t8 or cdip2-t8 8 dual-in-line 2 cqcc1-n20 20 square leadless chip carrier 1.2.5 lead finish . the lead finish is as specified in mil-prf-38535 for device classes q and v or mil-prf-38535, appendix a for device class m. 1.3 absolute maximum ratings . 1 / supply voltage (v s ) ......................................................................................... ? 22 v differential i nput volt age ................................................................................. ? 40 v input voltage (v in ) .......................................................................................... ? 20 v 2 / output short-circuit duration ............................................................................ i ndefinite internal power dissipation (p d ) ....................................................................... 500 mw 3 / junction temperature (t j ) ............................................................................... +150 ? c storage temperat ure range .............................................................................. -65 ? c to +150 ? c lead temperatur e (soldering, 60 seconds) ...................................................... +300 ? c thermal resistance, junction-to-case ( ? jc ) ..................................................... see mil-std-1835 1.4 recommended operating conditions . supply voltage (v s ) ......................................................................................... ? 15 v ambient operating temperature (t a ) ............................................................... -55 ? c to +125 ? c 1.5 radiation features . maximum total dose available (dose rate = 50 - 300 rad(si)/s) ....................... 100 kr ads(si) 4 / _____ 1 / stresses above the absolute maximum rating may cause pe rmanent damage to the device. extended operation at the maximum levels may degrade performance and affect reliability. 2/ unless otherwise specified, the absol ute maximum negative input voltage is equal to the negative power supply voltage. 3 / for case outline g at t a ? 80 ? c, derate linearly at 7.1 mw/ ? c. for case outline p at t a ? 75 ? c, derate linearly at 6.7 mw/ ? c. for case 2 at t a ? 80 ? c, derate linearly at 7.5 mw/ ? c. 4 / these parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. radiation end point limits for the noted paramet ers are guaranteed only for the conditions as specified in mil-std-883, method 1019, condition a.
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 4 dscc form 2234 apr 97 2. applicable documents 2.1 government specificat ion, standards, and handbooks . the following specification, standards, and handbooks form a part of this drawing to the extent specified herein. unless otherwise specified, the issues of thes e documents are those cited in t he solicitation or contract. department of defense specification mil-prf-38535 - integrated circuits, manufacturing, general specification for. department of defense standards mil-std-883 - test met hod standard microcircuits. mil-std-1835 - interface standard electronic component case outlines. department of defense handbooks mil-hdbk-103 - list of standard microcircuit drawings. mil-hdbk-780 - standard microcircuit drawings. (copies of these documents are available online at http://assist.daps.dla .mil/quicksearch/ or from the standardization document order desk, 700 robbins avenue, building 4d, philadelphia, pa 19111-5094.) 2.2 order of precedence . in the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. requirements 3.1 item requirements . the individual item requirements for device classes q and v shall be in accordance with mil-prf-38535 and as specified herein or as modified in th e device manufacturer's qualit y management (qm) plan. the modification in the qm plan shall not affect the form, fit, or function as described her ein. the individual item requirements for device class m shall be in accordance with mil-prf-38535, appendix a for non-jan class level b devices and as specified herein. 3.2 design, construction, and physical dimensions . the design, construction, and physical dimensions shall be as specified in mil-prf-38535 and herein for device classes q and v or mil-prf-38535, appendix a and herein for device class m. 3.2.1 case outlines . the case outlines shall be in accordance with 1.2.4 herein. 3.2.2 terminal connections . the terminal connections shall be as specified on figure 1. 3.2.3 radiation exposure circuit . the radiation exposure circuit shall be as specified on figure 2. 3.3 electrical performance characterist ics and postirradiation parameter limits . unless otherwise specified herein, the electrical performance characteristics and pos tirradiation parameter limits are as specified in table i and shall apply over th e full ambient operating temperature range. 3.4 electrical test requirements . the electrical test requirements shall be the s ubgroups specified in table iia. the electrical tests for each subgroup are defined in table i. 3.5 marking . the part shall be marked with the pin listed in 1.2 her ein. in addition, the manufacturer's pin may also be marked. for packages where marking of the entire smd pin number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. for rha product using th is option, the rha designator shall still be marked. marking for device classes q and v shall be in accordan ce with mil-prf-38535. marking for device class m shall be in accordance with mil-prf-38535, appendix a. 3.5.1 certification/compliance mark . the certification mark for device classes q and v shall be a "qml" or "q" as required in mil-prf-38535. the compliance mark for device class m s hall be a "c" as required in mil-prf-38535, appendix a.
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 5 dscc form 2234 apr 97 table i. electrical performance characteristics . test symbol conditions 1 / 2 / -55 ? c ? t a ? +125 ? c v s = ? 15 v group a subgroups device type limits unit unless otherwise specified min max input offset voltage v io r s = 50 ? 1 01,04 ? 1.0 mv 02,03 ? 2.0 2,3 01,04 ? 2.0 02,03 ? 3.0 m,d,p,l,r 1 01,04 ? 3.0 input offset current i io t j = +25 ? c, -55 ? c, v cm = 0 v 1,3 3 / all ? 50.0 pa t j = +125 ? c, v cm = 0 v 2 ? 8.0 na m,d,p,l,r, v cm = 0 v 1 01,04 ? 300 pa input bias current i ib t j = +25 ? c, -55 ? c, 1,3 3 / 01,04 ? 100 pa v cm = 0 v 02,03 ? 200 t j = +125 ? c, v cm = 0 v 2 all ? 10 na m,d,p,l,r, v cm = 0 v 1 01,04 ? 6 large signal voltage gain a vo v o = ? 10 v, r l ? 2 k ? 4 01,04 150 v/mv 02,03 750 5,6 all 30 m,d,p,l,r v o = ? 10 v, r l = 2 k ? 4 01,04 10 output voltage swing 4 / v o r l ? 2 k ? 4 all ? 11 v r l ? 10 k ? 5,6 ? 12 supply current i s v o = 0 v, t a = +25 ? c 1 all 8.5 ma m,d,p,l,r, v o = 0 v 1 01,04 8.5 see footnotes at end of table.
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 6 dscc form 2234 apr 97 table i. electrical performance characteristics ? continued. test symbol conditions 1 / 2 / -55 ? c ? t a ? +125 ? c v s = ? 15 v group a subgroups device type limits unit unless otherwise specified min max slew rate 4 / sr a vcl = +1, r l ? 2 k ? , 4 01,04 10.0 v/ ? s c l = 100 pf 5,6 7.5 4 02,03 7.5 5,6 5.0 settling time 4 / 5 / t s to 0.01 %, t a = +25 ? c 9 all 3.0 ? s to 0.05 %, t a = +25 ? c 2.1 to 0.10 %, t a = +25 ? c 1.8 common-mode 4 / rejection ratio cmrr v cm = ivr = ? 10.2 v 1 all 86 db 2,3 82 power supply rejection 4 / ratio psrr v s = ? 10 v to ? 16 v 1 01,04 51 ? v/v 02,03 80 2,3 all 100 input voltage range 4 / 6 / ivr 1,2,3 all ? 10.2 v gain bandwidth 4 / 7 / product a bw t a = +25 ? c 4 all 3.5 mhz 1 / rha devices supplied to this drawing have been characteri zed through all levels m, d, p, l, and r of irradiation. however, this device is only tested at t he ?r? level. pre and post irradiation val ues are identical unless otherwise specifi ed in table i. when performing post irradiation electrical measurements for any rha level, t a = +25 ? c. 2 / these parts may be dose rate sensitive in a space environm ent and may demonstrate enhanced low dose rate effects. radiation end point limits for the noted parameters are guaranteed only for the conditions as specified in mil-std-883, method 1019, condition a. 3 / t a = -55 ? c for i io and i ib tests, subgroup 3, is guaranteed by t a = +25 ? c test. 4 / this parameter not tested post radiation. 5 / settling time is defined here for a unity gain inverter connection using 2 k ? resistors. it is the ti me required for the error voltage (the voltage at the inverting input pin on the amplifier) to settle to within a specified percent of its final value from the time a 10 v step input is applied to the inverter. 6 / ivr test is defined as the v cm range used for the cmrr test. 7 / parameter guaranteed if not tested to the limits specified.
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 7 dscc form 2234 apr 97 device types 01 and 02 01 03, 04 case outlines g and p 2 2 terminal number terminal symbol 1 output a nc nc 2 -input a output a -input a 3 +input a nc +input a 4 -v s nc balance a 5 +input b -input a nc 6 -input b nc -v s 7 output b +input a nc 8 +v s nc balance b 9 --- nc +input b 10 --- -v s -input b 11 --- nc nc 12 --- +input b balance b 13 --- nc +v s (b) (see note 1) 14 --- nc output b 15 --- -input b nc 16 --- nc nc 17 --- output b nc 18 --- nc output a 19 --- nc +v s (a) (see note 1) 20 --- +v s balance a note: 1. +v s (a) and +v s (b) internally connected. 2. nc = no connection figure 1. terminal connections .
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 8 dscc form 2234 apr 97 figure 2. radiation exposure circuit .
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 9 dscc form 2234 apr 97 3.6 certificate of compliance . for device classes q and v, a certificate of compliance shall be required from a qml-38535 listed manufacturer in order to supply to the requirements of th is drawing (see 6.6.1 herein). for device class m, a certifica te of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in mil-hdbk-103 (see 6.6.2 herein). the certificate of compliance submitted to dla land and maritime -va prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's pr oduct meets, for device classes q and v, the requirements of mil-prf-38535 and herein or for device class m, the requirements of mil-prf-385 35, appendix a and herein. 3.7 certificate of conformance . a certificate of conformance as required fo r device classes q and v in mil-prf-38535 or for device class m in mil-prf-38535, appendix a shall be provided wi th each lot of microcircuits delivered to this drawing. 3.8 notification of change for device class m . for device class m, notification to dla land and maritime-va of change of product (see 6.2 herein) involving devices acquired to this dr awing is required for any change that affects this drawing. 3.9 verification and review for device class m . for device class m, dla land and maritime, dla land and maritime 's agent, and the acquiring activity retain the option to review the manufacturer's faci lity and applicable re quired documentation. offs hore documentation shall be made available on shore at the option of the reviewer. 3.10 microcircuit group assignment for device class m . device class m devices covere d by this drawing shall be in microcircuit group number 61 (s ee mil-prf-38535, appendix a). 4. verification 4.1 sampling and inspection . for device classes q and v, sampling and inspection procedures shall be in accordance with mil-prf-38535 or as modified in the device manufacturer's q uality management (qm) plan. the modification in the qm plan shall not affect the form, fit, or functi on as described herein. for device class m, sampling and inspection procedures shall be in accordance with mil-prf-38535, appendix a. 4.2 screening . for device classes q and v, screening shall be in accordance with mil-prf-38535, and shall be conducted on all devices prior to qualification and technology conform ance inspection. for device class m, screening shall be in accordance with method 5004 of mil-std-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 additional criteria for device class m . a. burn-in test, method 1015 of mil-std-883. (1) test condition a, b, c, or d. the test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. the test circuit shall specify the inputs, outputs, bi ases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) t a = +125 ? c, minimum. b. interim and final electrical test parameter s shall be as specified in table iia herein. 4.2.2 additional criteria for device classes q and v . a. the burn-in test duration, test cond ition and test temperature, or approved alte rnatives shall be as specified in the device manufacturer's qm plan in accordance with mil-prf-3853 5. the burn-in test circuit shall be maintained under document revision level control of the device manufacturer's technology review board (trb) in accordance with mil-prf-38535 and shall be made available to the acquiring or preparing activity upon request. the test circuit shall specify the inputs, outputs, bi ases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of mil-std-883. b. interim and final electrical test parameter s shall be as specified in table iia herein. c. additional screening for device class v beyond the requ irements of device class q shall be as specified in mil-prf-38535, appendix b.
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 10 dscc form 2234 apr 97 table iia. electrical test requirements . test requirements subgroups (in accordance with mil-std-883, method 5005, table i) subgroups (in accordance with mil-prf-38535, table iii) device class m device class q device class v interim electrical parameters (see 4.2) 1 1 1 final electrical parameters (see 4.2) 1,2,3,4,5,6 1 / 1,2,3,4,5,6 1 / 1,2,3, 1 / 2 / 4,5,6 group a test requirements (see 4.4) 1,2,3,4,5,6,9 1,2,3,4,5,6,9 1,2,3,4,5,6,9 group c end-point electrical parameters (see 4.4) 1 1 1 2 / group d end-point electrical parameters (see 4.4) 1 1 1 group e end-point electrical parameters (see 4.4) --- --- 1,4 1 / pda applies to subgroup 1. 2 / delta limits as specified in table iib shall be required where specifi ed and the delta limits shall be computed with reference to the previous interim electrical parameters. table iib. burn-in and operat ing life test delta parameters . 1 / 2 / test device limit delta unit type min max min max v os 01,04 -2.0 +2.0 -1.0 +1.0 mv 02 -3.0 +3.0 -1.0 +1.0 03 -5.0 +5.0 -1.0 +1.0 i ib 01,04 -150 +150 -75 +75 pa 02 -300 +300 -100 +100 03 -450 +450 -150 +150 1 / deltas are performed at room temperature. t a = +25 ? c. 2 / 240 hour burn-in and 1,000 hour operating group c life test.
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 11 dscc form 2234 apr 97 4.3 qualification inspection for device classes q and v . qualification inspection for device classes q and v shall be in accordance with mil-prf-38535. inspections to be performed sh all be those specified in mil-prf-38535 and herein for groups a, b, c, d, and e inspecti ons (see 4.4.1 through 4.4.4). 4.4 conformance inspection . technology conformance inspection for classes q and v shall be in accordance with mil-prf-38535 including groups a, b, c, d, and e inspections an d as specified. quality conformance inspection for device class m shall be in accordance with mil-prf-38535, appendix a and as specified herein. inspections to be performed for device class m shall be those specified in method 5005 of mil-std-883 and herein for groups a, b, c, d, and e inspections (see 4.4.1 through 4.4.4). 4.4.1 group a inspection . a. tests shall be as specif ied in table iia herein. b. subgroups 7, 8, 10, and 11 in table i, method 5005 of mil-std- 883 shall be omitted. 4.4.2 group c inspection . the group c inspection end-point electrical param eters shall be as specified in table iia herein. 4.4.2.1 additional criteria for device class m . steady-state life test conditi ons, method 1005 of mil-std-883: a. test condition a, b, c, or d. the test circuit sha ll be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquirin g activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of mil-std-883. b. t a = +125 ? c, minimum. c. test duration: 1,000 hours, except as permitted by method 1005 of mil-std-883. 4.4.2.2 additional criteria for device classes q and v . the steady-state life te st duration, test conditi on and test temperature, or approved alternatives shall be as spec ified in the device manufacturer's qm plan in accordance with mil-prf-38535. the test circuit shall be maintained under document revision level control by the device manufacturer's trb in accordance with mil-prf-38535 and shall be made available to the acquiring or prep aring activity upon request. the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of mil-std-883. 4.4.3 group d inspection . the group d inspection end-point electrical param eters shall be as specified in table iia herein. 4.4.4 group e inspection . group e inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). a. end-point electrical parameters shall be as specified in table iia herein. b. for device classes q and v, the devices or test vehicl e shall be subjected to radiation hardness assured tests as specified in mil-prf-38535 for the rha level being tested. for device class m, the devices shall be subjected to radiation hardness assured tests as specified in mil-prf-3 8535, appendix a for the rha level being tested. all device classes must meet the postirradiation end-point electr ical parameter limits as defined in table i at t a = +25 ? c ? 5 ? c, after exposure, to the subgroups specified in table iia herein. 4.4.4.1 total dose irradiation testing . total dose irradiation testing shall be performed in accordance with mil-std-883 method 1019, condition a and as specified herein.
standard microcircuit drawing size a 5962-88538 dla land and maritime columbus, ohio 43218-3990 revision level g sheet 12 dscc form 2234 apr 97 5. packaging 5.1 packaging requirements . the requirements for packaging shall be in accordance with mil-prf-38535 for device classes q and v or mil-prf-38535, appendix a for device class m. 6. notes 6.1 intended use . microcircuits conforming to this drawing are inte nded for use for government microcircuit applications (original equipment), design applic ations, and logistics purposes. 6.1.1 replaceability . microcircuits covered by this drawing will replac e the same generic device covered by a contractor- prepared specification or drawing. 6.2 configuration control of smd's . all proposed changes to existing smd's will be coordinated with the users of record for the individual documents. this coordination will be a ccomplished using dd form 1692, engineering change proposal. 6.3 record of users . military and industrial users should inform dla la nd and maritime when a system application requires configuration control and which smd's are applicable to that syst em. dla land and maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. users of drawings covering microelectroni c devices (fsc 5962) should contact dla land and maritime-va, telephone (614) 692-0547. 6.4 comments . comments on this drawing should be directed to dla land and maritime-va, columbus, ohio 43218-3990, or telephone (614) 692-0540. 6.5 abbreviations, symbols, and definitions . the abbreviations, symbols, and definitions used herein are defined in mil-prf-38535 and mil-hdbk-1331. 6.6 sources of supply . 6.6.1 sources of supply for device classes q and v . sources of supply for device clas ses q and v are listed in qml-38535. the vendors listed in qml-38535 have submi tted a certificate of compliance (see 3. 6 herein) to dla land and maritime-va and have agreed to this drawing. 6.6.2 approved sources of supply for device class m . approved sources of supply for class m are listed in mil-hdbk-103. the vendors listed in mil-hdbk-103 have agreed to this drawin g and a certificate of complia nce (see 3.6 herein) has been submitted to and accepted by dla land and maritime-va.
standard microcircuit drawing bulletin date: 10-09-21 approved sources of supply for smd 5962-88538 are listed below for immediate acquisition information only and shall be added to mil-hdbk-103 and qml-38535 during th e next revision. mil-hdbk-103 and qml-38535 will be revised to include the addition or deletion of sources. the vendors listed below have agreed to this drawing and a certificate of compliance has been subm itted to and accepted by dla land and maritime -va. this information bulletin is superseded by the next dated revision of mil-hdbk-103 and qml-38535. dla land and maritime maintains an online database of all current sources of supply at http://www.dscc.dla.mil/programs/smcr/ . standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962-8853801ga 3 / op215aj/883 3 / op215ah/883 5962-8853801pa 24355 (2) op215az 3 / op215aj8/883 5962-88538012a 3 / op215arc/833c 5962-8853801vga 24355 (4) op215aj/qmlv 5962-8853801vpa 24355 (4) op215az/qmlv 5962-8853801v2a 3 / op215arc/qmlv 5962-8853802ga 3 / op215bj/883 3 / op215ah/883 5962-8853202pa 3 / op215bz/883 3 / op215aj8/883 5962-88538032a 3 / op215brc/883 1 of 2
standard microcircuit drawing bulletin ? continued. standard microcircuit drawing pin 1 / vendor cage number vendor similar pin 2 / 5962r8853801vga 24355 (4) op215aj/qmlr 5962r8853801vpa 24355 (4) op215az/qmlr 5962R8853801V2A 3 / op215arc/qmlr 5962r8853804v2a 24355 (4) op215arc/qmlr 1 / the lead finish shown for each pin representing a hermetic package is the most readily available from the manufacturer listed for that part. if the desired lead finish is not listed contact the vendor to determine its availability. 2 / caution . do not use this number for item acquisition. items acquired to this number may not satisfy the performance requirements of this drawing. 3 / not available from an approved source of supply. vendor cage vendor name number and address 24355 (2) analog devices route 1 industrial park p.o. box 9106 norwood, ma 02062 point of contact: 804 woburn street wilmington, ma 01887-3462 24355 (4) analog devices route 1 industrial park p.o. box 9106 norwood, ma 02062 point of contact: 7910 triad center drive greensboro, nc 27409-9605 the information contained herein is disseminated for convenience only and the government assumes no liability whatsoever for any inaccuracies in the information bulletin. 2 of 2

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